3499拉斯维加斯

Die Attach Paste_packaging paste for semiconductor - Die Attach Paste_packaging paste for semiconductor -

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  • Die Attach Paste_packaging paste for semiconductor -
Die Attach Paste
HS-411 silver paste is designed for chip (such as LED/IC) packaging.
Product details
HS-411 silver paste is designed for chip (such as LED/IC) packaging

It has high thermal conductivity, high electrical conductivity and high reliability. Excellent rheological properties make it suitable for high speed dispensing.

Die Attach Paste_packaging paste for semiconductor -
HS-412 silver paste is designed for chip (such as high power LED) packaging

It has high thermal conductivity, high electrical conductivity and high reliability. In addition, high-temperature adhesion of the paste is excellent. This paste suits dispensing process.

Die Attach Paste_packaging paste for semiconductor -
Address:No.13, Riyue North Second Road, Qidingshan Street, Jinzhou District, Dalian City, Liaoning Province, China
Email Address:hs-tech@huashengchn.com
Contact person:Mr Ji
Phone:+86-411-39554099
Links: 中国半导体协会 中国电子元件行业协会 佳利电子 广春风华高新科技 华信安电子科技 三环集团 江苏灿勤科技
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